The ASCII/BASIC module must be installed in a Series
Six High-Capacity I/O rack or in a Model 60 CPU rack.
Being an intelligent device, the ASCII/BASIC module
can function independently of the CPU. As such, if communications with the CPU are not required, the module
may be located in a High Capacity I/O rack in a remote
l/O subsystem. Before installing the module, set the DualIn-Line Package (DIP) switches adjacent to the card slot
on the rack backplane to establish which group of eight
consecutive input and output points in the CPU I/O tables
will be used by the module being installed. For futher information on I/O DIP switch settings, refer to Figure 3
and Table 2.
Set the DIP switch banks A,B and C (user items 3,4 and 5
on Figure 2) on the module to the required configurations
(see Figures 5a, 5b and 5c), Verify the position of the configuration hybrid DIP package located between JI and 52,
it is user item 4 on Figure 2. It is marked